Jr., E. Graycochea and Rodriguez, R. and Gomez, F. R. and Bacquian, B. C. (2020) Multi-Hole Process Plate Modification for Chip on Lead Device at Die Attach Process. Journal of Engineering Research and Reports, 18 (3). pp. 7-10. ISSN 2582-2926
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Abstract
The paper focused on the improvement done in chip on lead (COL) leadframe package assembly manufacturing to address the leadframe bouncing effect during die attach process. A new and enhanced process plate is designed with multi-hole configuration to provide a strong vacuum underneath the leadframe and to maintain the planarity during dispensing and die bonding of silicon dies onto the leadframe. With the new multi-hole process plate, leadframe bouncing was successfully eliminated during die attach process. For future works, the multi-hole process plate could be used on devices with similar configuration.
Item Type: | Article |
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Subjects: | Open Library Press > Engineering |
Depositing User: | Unnamed user with email support@openlibrarypress.com |
Date Deposited: | 11 Mar 2023 09:30 |
Last Modified: | 28 May 2024 05:19 |
URI: | http://info.euro-archives.com/id/eprint/770 |